Thermal Grizzly Minus Pad 8

products, which are still a weak point - but the product portfolio can also be used for better and quieter cooling of gaming computers, workstations, mini PCs and many other purposes. In addition to higher cycle rates, better thermal conduction products enable quieter cooling and a longer service life of the components to be cooled.

In order to achieve these goals, Thermal Grizzly has worked closely with the well-known extreme overclocker novel "der8auer" Hartung during product development and tested, developed chemical compositions and analyzed competitors. Now the first product lines have been completed, which meet the highest demands of the manufacturer and the overclocking community.

The Thermal Grizzly Minus Pad 8 is the ideal choice for applications where thermal paste is not an option due to unwieldy application or where distances between the heat source and the heat sink have to be bridged - for example on memory chips and voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as a heat transfer medium - just like thermal pastes, and as a result it is similarly efficient.

The Minus Pad 8 is available in three different sizes - here 100 x 100 mm - and in four thicknesses between 0.5 and 2 millimetres, whereby the pads function excellently even at very low contact pressure and the thermal conductivity is only slightly affected by the thickness. The choice of thickness should therefore only depend on the gap to be bridged. Dimensions 100 x 100 x 1.5 mm.