Name: AMD EPYC 7262 - 3.2 GHz - 8 cores - 16 threads
Brand: Lenovo
SKU: 15694546
Price: 1020.24 EUR
Availability: InStock

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Lenovo

The AMD EPYC 7262 processor is specifically designed for use in data centers and offers high performance for demanding applications. With a base clock frequency of 3.2 GHz and the ability to reach up to 3.4 GHz in turbo mode, this processor is ideal for highly parallel workloads. It features 8 cores and 16 threads, enabling efficient data processing and improved multitasking capabilities. The 7nm lithography ensures high energy efficiency and performance, while the octa-channel memory access maximizes bandwidth for data-intensive applications. The EPYC 7262 supports DDR4 SDRAM with clock rates of up to 3200 MHz, increasing flexibility in memory selection. These features make the processor an excellent choice for companies that rely on powerful and reliable data centers.

- Maximum Thermal Design Power (TDP) of 155 watts
- Supports PCI Express Version 4 for high data transfer rates
- 128 MB L3 cache for improved data processing
- 64-bit architecture for modern applications
- Optimized for big data analytics and memory-intensive workloads.

Actual product image Lenovo AMD EPYC 7262 - 3.2 GHz - 8 cores - 16 threads (SP3, 3.20 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Number of threads

PCI express version (max.)

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AMD EPYC 7262 - 3.2 GHz - 8 cores - 16 threads

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