Name: Core i9 12900KF LGA1700 Cache
Brand: Intel
SKU: 17698153
Price: 322.68 EUR
Availability: InStock
Rating: 4.92 (12 reviews)

isSSR

offer

olderThan3MonthTimestamp

path

sectorId

shopArea

slug

tagIds

productDetailPageQuery

productBySlug

alternateLinks

dutchAuctionBannerLazy

alternateLinksByPath

currentAuctionEvent

Intel

Intel Directed I/O Virtualization Technology (VT-d)  
The Intel Directed I/O Virtualization Technology (VT-d) continues the existing support for virtualization solutions for IA-32 (VT-x) and Itanium processor systems (VT-i) and expands it with new support for I/O device virtualization. Intel VT-d can help users improve the security and reliability of systems as well as the performance of I/O devices in virtualized environments.

Intel Virtualization Technology (VT-x)  
With Intel Virtualization Technology (VT-x), a hardware platform can be used as multiple "virtual" platforms. It offers improved manageability through reduced downtime and maintains productivity by shifting computing operations into separate partitions.

Intel 64  
In conjunction with the appropriate software, the Intel 64 architecture enables 64-bit processing in servers.

Actual product image Intel Core i9 12900KF LGA1700 Cache (LGA 1700, 3.20 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Your data. Your choice.

Search

Intel Core i9 12900KF LGA1700 Cache

Product details

Compare products

Goes with

Reviews & Ratings

Intel Core i9 12900KF LGA1700 Cache

Product details

Description

Specifications

Price trend

Magazine articles

Compare products

Similar products

Sales rank in Processors

Goes with

Accessories

Reviews & Ratings

Warranty & return rates

Magazine articles

Test reports1