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The Intel Xeon E5-2670 v3 is a powerful processor specifically designed for use in server environments. With an advanced 22nm lithography and an architecture optimized for 64-bit operating systems, this processor offers high efficiency and performance. It features 12 cores and supports up to 24 threads, enabling excellent multitasking capabilities. The maximum clock frequency of 3.1 GHz in Turbo mode ensures that even compute-intensive applications can be processed efficiently. The processor supports DDR4 SDRAM and allows for a maximum memory capacity of 768 GB, making it ideal for memory-intensive applications. With a TDP of 120 watts, it is also energy-efficient and suitable for use in modern data centers.

- 12 cores and 24 threads for high multitasking performance
- Maximum clock frequency of 3.1 GHz in Turbo mode
- Supports up to 768 GB of DDR4 SDRAM
- Quad-channel memory architecture for improved bandwidth
- Compatible with LGA 2011-v3 socket.

Actual product image HPE Intel Xeon E5-2670 v3 (LGA 2011-v3, 2.30 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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